Replacement of Copper Cyanide by Copper Sulfate on Electroless Brass Plating Process

Authors

  • Carlos Dominguez-Rios Centro de Investigación en Materiales Avanzasdos S.C.

DOI:

https://doi.org/10.14738/aivp.86.9136

Keywords:

Brass; Electroless; Cyanide; Sulfate; Electrochemical; Zamak

Abstract

Environmentally friendly processes and health protection are industrial requirements nowadays. Surface finishing industry demands the improvement of the composition of bath solutions, and specifically, reduction or elimination of the use of toxic substances to simplify complexity on wastewater treatment. This work presents results on the replacement of copper cyanide by copper sulfate in the composition of an electroless brass plating bath used on zamak alloy coating. The effect of the concentration of copper sulfate on the morphological and brass film color characteristics was studied. Characterization of plated pieces was made by scanning electron microscopy, optical microscopy, L*, a*, b* color parameters and by spectrophotometry and electrochemical techniques. Results indicate that copper cyanide can be successfully substituted, being possible to control the color of brass plating on this new process.

References

Kowalski, A. J. Brass plating, Plating & Surface Finishing, 85 (1998) 36

Blum, W. and Hogeboom G.B. Principles of Electroplating and Electroforming, third edition, McGraw-Hill (1949).

Strow, H. Surface Engineering, vol. 5, ASM Handbook (2005).

Sanchez, H.; Chainet, E.; Nguyen, B.; Ozil, P. and Meas, Y. Electrochemical Deposition of Silver from a Low Cyanide Concentration Bath, Journal of The Electrochemical Society, 143 (1996) p. 2799–2804.

Sullivan, M. and Kohl, P. A. Electrochemical Study of the Gold Thiosulfate Reduction, Journal of the Electrochemical Society, 144 (1997) 1686–1690.

Sato, J. Kato, M. Otani, H. Homma, T. Okinaka, Y. Osaka, T. and Yoshioka, O. Substrate Ni Catalyzed Electroless Gold Deposition from a Noncyanide Bath Containing Thiosulfate and Sulfite. Journal of the Electrochemical Society, 149 (2002) C168–C172.

Nabil Zaki, High Performance Alkaline Cyanide-Free Zinc Plating Carbon Rich Deposit, AESF SUR/FIN® Proceedings (2002) 638–647.

Fujiwara, Y. and Enomoto, H. Characterization of Cu-Zn Alloy Deposits from Glucoheptonate Baths, Surface and Coatings Technology, 35 (1988) 113–124.

Ameen, T. J. and Orloff, G. L. Non-Cyanide Brass Plating Bath and a Method of Making Metallic Foil Having a Brass Layer Using the Non-Cyanide Brass Plating Bath, Patent USA No. 5762778 A (1998).

Carlos, A. De Almeida M, R. H., Study of the Influence of the Polyalcohol Sorbitol on the Electrodeposition of Copper-Zinc Films from a Non-Cyanide Bath, Journal of Electroanalytical Chemistry, 562 (2004) 153–159.

Guaus, E.; Torrent-Burgués, J. Tin–Zinc Electrodeposition from Sulphate–Tartrate Baths, Journal of Electroanalytical Chemistry, 575 (2005) 301–309.

Juskenas, R. Karpavičienė V., Pakštas, V., Selskis A., Kapočius V., Electrochemical and XRD Studies of Cu–Zn Coatings Electrodeposited in Solution with D-mannitol, Journal of Electroanalytical Chemistry, 602 (2007) 237–244.

De Almeida, M.R.H.; Barbano, E.P.; de Carvalho, M.F.; Carlos, I.A.; Siqueira, J.L.P.; Barbosa, L.L. Electrodeposition of Copper–Zinc from an Alkaline Bath Based on EDTA, Surface & Coatings Technology, 206 (2011) 95–102.

Ballesteros, J.C.; Torres-Martínez, L.M.; Juárez-Ramírez, I.; Trejo, G.; Meas, Y. Study of the Electrochemical Co-Reduction of Cu2+ and Zn2+ Ions from an Alkaline Non-Cyanide Solution Containing Glycine, Journal of Electroanalytical Chemistry, 727 (2014) 104–112.

Minggang, L.; Guoying, W.; Shuangshuang, H.; Shuhan, X.; Yejiong Y. and Qinfang, M. Electrodeposition of CuZn Alloys from the Non-Cyanide Alkaline Bath, Surface Review and Letters, 22 (2015) 1550003-1–1550003-6.

Ramírez C., Calderón, J.A. Study of the effect of Triethanolamine as a chelating agent in the simultaneous electrodeposition of copper and zinc from non-cyanide electrolytes, Journal of Electroanalytical Chemistry 765 (2016) 132–139.

Ding, L.; Liu, F.; Cheng, J.; Niu, Y. Effects of four N-based additives on imitation gold plating, Journal of Applied Electrochemistry, Published online 13 January 2018, https://doi.org/10.1007/s10800-018-1148-8

C. Domínguez-Ríos, M.V. Moreno, R. Torres-Sánchez, W. Antúnez, A. Aguilar-Elguézabal, J. González-Hernández, Effect of Tartrate Salt Concentration on the Morphological Characteristics and Composition of Cu-Zn electroless plating on Zamak 5 zinc alloy, Surface & Coatings Technology, 202, (2008) 4848–4854.

C. Domínguez, M.V. Moreno, A. Aguilar-Elguézabal, Process for Autocatalytic Brass Plating on Zamak Alloys, Plating and Surface Finishing, 88 (2001) 91–99.

A. Hurtado-Macias, C. Domínguez-Ríos, J. Muñoz-Saldaña, R. Torres-Sánchez, S.A. Pérez-García, and J. González-Hernández, Effect of Surface Substrate Roughness and of Chelating Agent on the Microstructure and Mechanical Properties of Electroless Processed Brass Coatings, Industrial & Engineering Chemistry Research 49 (2010) 6388–6393.

C. Domínguez-Ríos, M.V. Moreno López, S.V. Miranda Navarro, Mejoras al proceso de latonado por inmersión para piezas de aleaciones base zinc, Mexican Patent No. MX 229, 256 (2005).

Standard Guide for Preparation of Zinc Alloy Die Casting for Electroplating and Conversion Coatings, Active Standard ASTM B 252-92 (2009), Book of Standards, vol. 02.05.

Martyak, N.M.; McDuffie, B. Side Reactions in Electroless Copper, Part I. Distillation of Ammonia, Metal Finishing, 88 (1990) 51–54

Saubestre, E.B. Stability of electroless copper solutions, Plating, 59 (1972) 563– 566.

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Published

2020-11-10

How to Cite

Dominguez-Rios, C. (2020). Replacement of Copper Cyanide by Copper Sulfate on Electroless Brass Plating Process. European Journal of Applied Sciences, 8(6), 102–112. https://doi.org/10.14738/aivp.86.9136